Yogesh Joshi
· ProfessorGeorgia Institute of Technology · Marketing
Active 1976–2025
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About
Yogesh Joshi is a professor at the Robert H. Smith School of Business, with expertise in competitive marketing strategies, innovation, product and brand management. His research has been published in leading business journals such as Marketing Science, Management Science, the Journal of Marketing, and the Journal of Marketing Research. He teaches courses on innovation, product development, marketing analytics, and strategic marketing models across undergraduate, MS, MBA, and PhD programs. His research interests include strategic marketing decisions involving product differentiation, advertising, innovation diffusion, and social influence, with notable contributions analyzing signaling quality through advertising, consumer behavior in indulgent consumption, social tags for brand perception, product line strategies, and market entry timing in social influence contexts.
Research topics
- Computer Science
- Engineering
- Materials science
- Mechanical engineering
- Electrical engineering
- Automotive engineering
- Aerospace engineering
- Meteorology
- Environmental science
- Physics
Selected publications
Comparison of electro-thermal performance of advanced cooling techniques for electric vehicle motors
Applied Thermal Engineering · 2020 · 123 citations
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics
IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 84 citations
Senior authorCorrespondingThe Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012–2015 to target an order of magnitude improvement in chip level and hot spot heat fluxes, compared to the then state-of-the-art (SOA). Evaporative cooling technologies to achieve potential targets of 1 kW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>…
Thermal management of power electronics with liquid cooled metal foam heat sink
International Journal of Thermal Sciences · 2021 · 60 citations
Senior authorCorrespondingEnhancing the performance of aluminum foam heat sinks through integrated pin fins
International Journal of Heat and Mass Transfer · 2020 · 56 citations
Senior authorCorrespondingToward TSV-Compatible Microfluidic Cooling for 3D ICs
IEEE Transactions on Components Packaging and Manufacturing Technology · 2024-12-12 · 12 citations
articleCooling presents a significant challenge for high-performance 3-D integrated circuits (3D ICs). To this end, this research explores through-silicon via (TSV)-compatible micropin-fin heat sink (MPFHS) for high-power 3-D chip stacks. Copper TSVs with a diameter of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$5.2~\mu $ </tex-math></inline-formula>m and a high aspect ratio (HAR) of 29:1 are developed. An extens…
Frequent coauthors
- 68 shared
Andrei G. Fedorov
Georgia Institute of Technology
- 27 shared
Muhannad S. Bakir
Georgia Institute of Technology
- 26 shared
Avram Bar‐Cohen
Intel (United States)
- 23 shared
Vaibhav K. Arghode
Indian Institute of Technology Kanpur
- 19 shared
Dereje Agonafer
The University of Texas at Arlington
- 19 shared
Emad Samadiani
Google (United States)
- 19 shared
Wataru Nakayama
- 18 shared
Craig E. Green
Georgia Institute of Technology
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