Keren Bergman

Massively scalable Kerr comb-driven silicon photonic link

Nature Photonics · 2023 · 177 citations

Abstract The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limited ‘chip-escape’ bandwidth densities, is perhaps the singular factor determining the scalability of future systems. Using light to send information between compute nodes in such systems can dramatically increase the available bandwidth while simultaneously decreasing energy consumpti…

Silicon Photonics Codesign for Deep Learning

Proceedings of the IEEE · 2020 · 89 citations

Deep learning is revolutionizing many aspects of our society, addressing a wide variety of decision-making tasks, from image classification to autonomous vehicle control. Matrix multiplication is an essential and computationally intensive step of deep-learning calculations. The computational complexity of deep neural networks requires dedicated hardware accelerators for additional processing throughput and improved energy efficiency in order to enable scaling to larger networks in the upcoming a…

Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers

Journal of Lightwave Technology · 2020 · 76 citations

Widespread adoption of silicon photonics into datacenters requires that the integration of the driving electronics with the photonics be an essential component of transceiver development. In this article, we describe our silicon photonic transceiver design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A silicon interposer is used to provide connectivity between the photonic integrated circuit (PI…

Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links

Nature Photonics · 2025-03-21 · 68 citations

Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by leveraging vast distributed networks of advanced semiconductor chips. However, a barrier for AI scaling is the disproportionately high energy and chip area required to transmit data between the chips. Here we present a solution to this long-standing overhead through dense three-dimensional (3D) integration of photonics and electronics. With 80 photonic transmitters and receivers occupying a com…

Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity

2024-04-21 · 18 citations

Embedded silicon photonics (SiPh) is promising to enable ultra-high bandwidth system-wide connectivity with vastly reduced energy consumption by integrating optics deeply within computing sockets. We present the design and characterization of a dense wavelength-division multiplexing (DWDM) SiPh transceiver chip, featuring a unique architecture in the multi-FSR regime and targeting a shoreline bandwidth density of 2 Tbps/mm with a sub-pJ/b energy consumption, providing a viable path toward die-to…