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Juejun Hu

Juejun Hu

· Professor of Materials Science and Engineering

Massachusetts Institute of Technology · Materials Science and Engineering

Active 2005–2026

h-index62
Citations14.6k
Papers525216 last 5y
Funding$3.5M3 active

Academic metrics are sourced from OpenAlex and public funding records; values may differ from Google Scholar.

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About

Juejun Hu is the John F. Elliott Professor of Materials Science and Engineering at MIT. His research group develops novel materials and devices that harness light-matter interactions for a broad range of applications, including on-chip sensing and spectroscopy. His work leverages digital Fourier transform technology to build miniaturized, rugged sensors compatible with mass production for industrial process control, medical imaging, and space systems. A major focus of his research is on optical phase-change materials and meta-optics. These materials exhibit reversible changes in their optical properties during solid-state phase transitions, enabling the creation of reconfigurable optical devices that can be programmably adapted to specific functionalities. Additional research directions include flexible and polymer photonics for biomedical monitoring and high-speed data communications, advanced imaging and sensing optics for consumer and automotive electronics, and magneto-optical isolation. His group is also developing chip-scale nonreciprocal photonic devices functioning as one-way valves for light, which are crucial for next-generation optical communication and navigation systems.

Research topics

  • Computer Science
  • Materials science
  • Optoelectronics
  • Nanotechnology
  • Physics
  • Optics
  • Engineering physics
  • Engineering
  • Systems engineering
  • Software engineering

Selected publications

  • Electrically reconfigurable non-volatile metasurface using low-loss optical phase-change material

    Nature Nanotechnology · 2021 · 493 citations

    Senior authorCorresponding
  • Reconfigurable all-dielectric metalens with diffraction-limited performance

    Nature Communications · 2021 · 385 citations

    Active metasurfaces, whose optical properties can be modulated post-fabrication, have emerged as an intensively explored field in recent years. The efforts to date, however, still face major performance limitations in tuning range, optical quality, and efficiency, especially for non-mechanical actuation mechanisms. In this paper, we introduce an active metasurface platform combining phase tuning in the full 2π range and diffraction-limited performance using an all-dielectric, low-loss architectu…

  • Single-Element Diffraction-Limited Fisheye Metalens

    Nano Letters · 2020 · 233 citations

    Wide field-of-view (FOV) optical functionality is crucial for implementation of advanced imaging and image projection devices. Conventionally, wide FOV operation is attained with complicated assembly of multiple optical elements known as "fisheye lenses". Here we present a novel metalens design capable of performing diffraction-limited focusing and imaging over an unprecedented near 180° angular FOV. The lens is monolithically integrated on a one-piece flat substrate and involves only a single l…

  • Nanofabrication for Nanophotonics

    ACS Nano · 2025-03-28 · 92 citations

    reviewOpen access

    Nanofabrication, a pivotal technology at the intersection of nanoscale engineering and high-resolution patterning, has substantially advanced over recent decades. This technology enables the creation of nanopatterns on substrates crucial for developing nanophotonic devices and other applications in diverse fields including electronics and biosciences. Here, this mega-review comprehensively explores various facets of nanofabrication focusing on its application in nanophotonics. It delves into hig…

  • Integrated Photonics Packaging: Challenges and Opportunities

    ACS Photonics · 2022 · 87 citations

    Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the “packaging bottleneck”.

Recent grants

Frequent coauthors

  • Anu Agarwal

    203 shared
  • Kathleen Richardson

    190 shared
  • Tian Gu

    Massachusetts Institute of Technology

    186 shared
  • Lionel C. Kimerling

    Massachusetts Institute of Technology

    180 shared
  • Hongtao Lin

    State Key Laboratory of Modern Optical Instruments

    127 shared
  • Qingyang Du

    Zhejiang Lab

    92 shared
  • Vivek Singh

    L V Prasad Eye Institute

    85 shared
  • Mikhail Y. Shalaginov

    Massachusetts Institute of Technology

    81 shared

Labs

  • Photonic Materials GroupPI

Education

  • Ph.D., Materials Science and Engineering

    Massachusetts Institute of Technology

    1999
  • M.S., Materials Science and Engineering

    University of California, Berkeley

    1994
  • B.S., Materials Science and Engineering

    University of Science and Technology of China

    1991

Awards & honors

  • Vittorio Gottardi Prize, International Commission on Glass (…
  • SPIE Early Career Achievement Award (2019)
  • Robert L. Coble Award, American Ceramic Society (2017)
  • Faculty Early Career Development Award, National Science Fou…
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